QFN PCB assembly (Computers - Hardware)
Item ID 9530744 in Category: Computers - Hardware
QFN PCB assembly | |
A QFN PCB assembly is composed of the bond wire, lead frame, silicon die, exposed pad, die-attach, and mold compound. The silicon die, lead frame, and solder pads are the three essential components. The die is the actual simulated circuit chip, which is the holder of the IC's electrical circuitry. The lead frame is the connection between the die and the rest of the QFN structure, while the solder pads are the link between the package and the circuit board. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WahtsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com  | |
| Target Nation: All Nations Target City : Shenzhen Last Update : 03 June 2024 11:52 AM Number of Views: 162 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2024-11-21 (0.225 sec)