Flip Chip CSP Substrate: Efficiency, Reliability, and Application (Computers - Hardware)
Item ID 9610467 in Category: Computers - Hardware
Flip Chip CSP Substrate: Efficiency, Reliability, and Application | |
A flip chip essentially implies that the chip is flipped over to make an association with the substrate or lead outline. Flip chip doesn't rely upon the wire holding for of interconnection however it utilizes patch or knocks like copper support point. This implies that the I/O cushions can be put at any part of the outer layer of the chip and consequently the chip size can be diminished with a proper hardware way. Contact info:- https://efpcb.wordpress.com/2024/09/25/flip-chip-csp-substrate-efficiency-reliability-and-application/ | |
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| Target Nation: All Nations Target City : Shenzhen Last Update : 02 November 2024 2:57 PM Number of Views: 112 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2024-11-23 (0.223 sec)