PCB Interposers and IC Substrates: Bridging the Gap between Chips and Circuit Boards (Computers - Hardware)
Item ID 9672019 in Category: Computers - Hardware
PCB Interposers and IC Substrates: Bridging the Gap between Chips and Circuit Boards | |
IC packaging substrate represents the ultimate in miniaturization in this kind of manufacturing and methods are based on semiconductor technology. Flip-chip techniques and interconnect wire bonding are two additional ways in which it can be bonded to the board via IC packaging substrates. Contact info:- https://efpcb.weebly.com/blog/pcb-interposers-and-ic-substrates-bridging-the-gap-between-chips-and-circuit-boards  | |
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| Target Nation: All Nations Target City : Shenzhen Last Update : 04 March 2025 3:00 PM Number of Views: 59 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2025-04-03 (0.222 sec)